Development of conductive paste and ink centered on silver nanoparticles and low-temperature sintering.
What is the design technology for low-temperature sintering!? How is it applied to die attach materials?
Conductive Pastes/Inks Using Mainly Ag Nanoparticles: R&D, Sintering at Low Temp., etc. ★What are the design techniques for low-temperature sintering!? Applications to die attach materials? ★How can we create a dense structure to ensure conductivity!? ★Let's learn about the latest development trends focusing on storage stability, adhesion to substrates, and heat resistance after sintering!! 【Venue】 Kawasaki City International Exchange Center, 2F, Room 4 【Kanagawa, Kawasaki】 Date and Time August 9, 2013 (Friday) 13:30-17:45
- Company：AndTech
- Price：10,000 yen-100,000 yen
